Taipei [Taiwan], January 7: MediaTek Inc., a leading Taiwanese smartphone IC designer, unveiled its new Filogic 8000 family Wi-Fi 8 chipset at the 2026 Consumer Electronics Show (CES) in Las Vegas. The platform is designed for a wide range of products, including broadband gateways, enterprise access points, smartphones, notebooks, tablets, TVs, streaming devices, and Internet of Things (IoT) devices.
The company highlighted that the chipset delivers high reliability and performance in crowded wireless environments, addressing issues like interference, unstable connections, and slow response times. Alan Hsu, MediaTek’s Corporate Vice President and General Manager of the Intelligent Connectivity Business Unit, noted that the demonstrations at CES showcase the company’s commitment to advancing next-generation wireless technologies and maintaining leadership in Wi-Fi solutions.
MediaTek aims to equip flagship and high-end devices with the Filogic 8000 chipset. Early customers are expected to include Taiwan’s Asustek Computer Inc. and Acer Inc., US-based HP, Japan’s Buffalo Inc., Taiwanese broadband supplier Arcadyan Technology Corp., and AI server maker and iPhone assembler Hon Hai Precision Industry Co. Samples of the new chipset are expected to reach customers later this year.
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