New Delhi [India], January 4: Projects under the government’s Design Linked Incentive (DLI) Scheme are witnessing rapid growth, with 16 chip designs (tape-outs), six ASIC chips fabricated, 10 patents filed, engagement of over 1,000 engineers, and more than threefold private investment leveraged.
The DLI Scheme, implemented under the Ministry of Electronics and Information Technology (MeitY) as part of the Semicon India Programme, aims to build a self-reliant and globally competitive chip design ecosystem. A total of 24 DLI-supported projects target strategic sectors including video surveillance, drone detection, energy metering, microprocessors, satellite communications, and IoT SoCs.
India is seeking to strengthen its domestic semiconductor capabilities amid growing global demand and concentrated manufacturing in limited geographies, making supply chains vulnerable. The DLI Scheme provides financial incentives and access to advanced design infrastructure for startups and MSMEs, supporting the entire semiconductor design lifecycle—from concept and prototyping to deployment of integrated circuits, chipsets, Systems-on-Chip (SoCs), and IP cores.
Since its launch in December 2021, the scheme has enabled domestic companies to translate innovation into execution, resulting in multiple tape-outs, fabricated chips, patents, and the training and engagement of skilled engineers. The programme also encourages indigenous semiconductor content, reduces import dependence, and strengthens supply chain resilience.
Operating under the larger Rs 76,000 crore India Semiconductor Mission, the DLI Scheme is a key instrument for anchoring India in the high-value segment of the global semiconductor ecosystem. C-DAC serves as the nodal agency responsible for its implementation.
The government stated that the scheme’s tangible outcomes signal India’s emergence as a strategic and reliable player in the global semiconductor landscape. (ANI)
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